Our client is a global semiconductor company and the world's leading designer and supplier of digital signal processors and analog integrated circuits, the engines driving the digitization of electronics. These two types of semiconductor products work together in digital electronic devices such as digital cellular phones. Our client is a world leader in the design and manufacturing of other semiconductor products. These include standard logic, application-specific integrated circuits, reduced instruction-set computing microprocessors, micro-controllers and digital imaging devices.
They currently have several openings for Product/Test Engineer in their Houston and Dallas, Texas locations.
Candidates for the position of Product Engineer will work with the following product groups:
• DSP - DSP's for many different applications. Mix of highest performance DSP's on the market down to lower-end devices with low selling price.
• BBC - DSP devices specific to BroadBand communication applications (DSL modems, Cable modems).
• IAG - DSP devices for specific growth applications such as Internet-audio devices and digital cameras.
• Sparc - Family of Microprocessors used by SUN Microsystems to power their computers and servers.
Overall Product Engineer Responsibilities
1) Device Test
This is the largest component of product engineering positions. Devices are tested AND engineered on "testers", "ATE", VLSI Testers. Testers are either "Digital" or "Digital with Mixed Signal Capabilities". Using common roadmap testers such as "Fusion" by LTX.
2) Design for Test (DFT, DFTM, DFM)
Candidate will work with design team to define/specify design for test features of a new product. Candidate will have worked with DFT before in a product engineering/test role. Preferred experience on a similar class product. Candidate will apply DFT skills/knowledge by working with design team to specify features (special "logic", special test modes) to be added to design for DFT. These features allow design to be more easily tested and manufactured (added test capability, lower cost manufacturability).
3) Data Analysis/Product Improvement
Responsible for collecting/using data collected at many of the manufacturing test points and "analyzing" to find the causes of behaviors and deviations of concern. Correlate wafer fab manufacturing process to end results (product yield, speed performance).Have experience with statistical analysis packages such as: SAS, IDS.
4) Creating Test Program
Responsible for creating/writing test program. Experience creating/writing a test program on a device which is similar in scope to a DSP, microprocessor is preferred. Qualified candidates have experience with yield improvement and other cost reduction activities (test time reduction, "flow" simplification).
Candidates are responsible for creating test programs for all three of the following phases of development:
A- Validation and debug of a new product and subsequent product revs.
B- Continuous improvements: Yield improvement, test time reduction, product reliability improvements.
C- Manufacturing test. Write test program to screen each device/die. Both at wafer level form (Multiprobe test, wafer sort test) and also packaged unit test (Final Test).
5) Device Responsibility
Working with support groups; wafer fab, assembly test (A/T) factory, QRA, packaging, marketing. Experience with "device/product responsibility" a must. Preferably test create/debug/sustain, yield, qualification, & cost reduction.
6) Wafer Fab Experience
Working closely with (or in) wafer fabs on frequent basis. Perhaps have training/classes in "Wafer Fabrication."
7) Failure Analysis
Isolating cause of "failure." Responsible for the execution of failure testing. Experience working in Failure Analysis or closely with Failure Analysis personnel/Lab. Using tools such as: EMMI, Liquid Crystal, FMI, Electrical Beam (e-beam) probing, Optical Beam (o-beam) probing, physical microprobing, FIB (focused Ion beam).
8) Reliability/Qualification
Knowledge/experience in device physics (AKA solid state) and device reliability. Responsible for "Qual" or "Qualification" (process of running "reliability" tests, and then driving to resolve any failures). Experience gathering information from the run isolating problems/failures and defining solutions. Experience with "burnin reduction/elimination" preferred. Experience with reliability tests: HTOL, 85/85, biased humidty, ESD, latchup, pressure cooker
9) Assembly Test (A/T) Support
To "support" the A/T site for any device-specific requirement; test program, test-related yields, burnin capability, A/T sites are usually in far-east. This is "manufacturing" part of the job.
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